Document fins/I0567-1
FIN #: I0567-1
SYNOPSIS: Cleaning kit available for cleaning silicon oil from System boards
for Enterprise Systems
DATE: Mar/24/00
KEYWORDS: Cleaning kit available for cleaning silicon oil from System boards
for Enterprise Systems
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- Sun Proprietary/Confidential: Internal Use Only -
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FIELD INFORMATION NOTICE
(For Authorized Distribution by SunService)
SYNOPSIS: Cleaning kit available for cleaning silicon oil from
System boards for Enterprise Systems.
TOP FIN/FCO REPORT: No
PRODUCT_REFERENCE: System Board Silicon Pad
PRODUCT CATEGORY: Server / System Board
PRODUCTS AFFECTED:
Mkt_ID Platform Model Description Serial Number
------ -------- ----- ----------- -------------
Systems Affected
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- E3000 ALL Ultra Enterprise 3000 -
- E3500 ALL Ultra Enterprise 3500 -
- E4000 ALL Ultra Enterprise 4000 -
- E4500 ALL Ultra Enterprise 4500 -
- E5000 ALL Ultra Enterprise 5000 -
- E5500 ALL Ultra Enterprise 5500 -
- E6000 ALL Ultra Enterprise 6000 -
- E6500 ALL Ultra Enterprise 6500 -
- E10000 ALL Ultra Enterprise 10000 -
X-Options Affected
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- - - - -
PART NUMBERS AFFECTED:
Part Number Description Model
----------- ----------- -----
565-1647-01 FRU. Kit, Electro-Wash, Mod Cleaner -
REFERENCES:
FIN: I0537-2
ECO: WO_16821
ECO: WO_22491
URL: http://www.chemtronics.com/usmsds/3102.PDF
http://www.chemtronics.com/usmsds/3102.DOC
PROBLEM DESCRIPTION:
The thermal pad underneath the CPU module has a tendency to excrete
silicon oil when the pad is under pressure and heat. While not
conductive, the oil does attract contaminants that can be conductive or
insulate the connection between the module and the system board.
The excretion of silicone oil is an inherent characteristic of the
silicone-based pad material and can not be eliminated with current
technology.
A longer term solution is being developed where by the pad material
will be sealed in an antistatic envelope, thus containing any excreted
silicone oil.
The silicone oil appears as a thick oily residue that precipitates from
the thermal pad which seeps down toward and onto adjacent components.
Often this residue will attract dust and debris.
IMPLEMENTATION:
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| | MANDATORY (Fully Pro-Active)
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| | CONTROLLED PRO-ACTIVE (per Sun Geo Plan)
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| X | REACTIVE (As Required)
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CORRECTIVE ACTION:
Enterprise Customers and authorized Field Service Representatives may
avoid the above mentioned problem by following the recommendations
as shown below:
When replacing a CPU module, use module cleaning kit (p/n: 565-1647-01)
to clean the system board connector pads. The intent is not to remove
working modules but to only clean the pads on the system board where
defective modules are being replaced.
1. Wear an ESD Strap and place the system board on a static-free work
surface in a well ventilated area.
2. Remove the suspect processor module(s) using the normal technique.
3. Do not spray electrowash solvent directly onto ECB assemblies or
components. Instead, spray a small amount of electrowash solvent
onto a new lint free wipe and wipe on affected area of the system
board/processor module to clean visible oil residue and debris.
4. Apply a small amount of electrowash solvent onto a new lint free wipe
and clean the gold pads of the system board using a fresh wipe for
each area to prevent transferring the residue. Repeat as needed
using a fresh wipe each time.
5. Using a clean wipe, repeat STEP 4 with a single final wipe stroke
in one direction.
6. Soak a balled-up wipe with electrowash solvent and daub the exposed
connector pins of the processor connector(s); Repeat as needed until
they are clean.
7. Using a clean wipe, repeat STEP 6 with a single final wipe stroke in
one direction. Allow to dry fully.
8. Use brush to remove any wipe fragments or debris.
9. Spray a small amount of electrowash solvent onto a new lint free
wipe and wipe off any visible debris and oil from the thermal pad
itself.
10. Do a final inspection of all connector pins, connector pads, and
neighboring components prior to re-assembly; clean as needed.
11. Reinstall modules using the approved technique (Torque sequence, etc.).
COMMENTS:
None
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Implementation Footnote:
i) In case of MANDATORY FINs, Enterprise Services will attempt to
contact all affected customers to recommend implementation of
the FIN.
ii) For CONTROLLED PROACTIVE FINs, Enterprise Services mission critical
support teams will recommend implementation of the FIN (to their
respective accounts), at the convenience of the customer.
iii) For REACTIVE FINs, Enterprise Services will implement the FIN as the
need arises.
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General:
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